PCBs, Electronic Assembly and Moulded Interconnect Devices (3D MID)

• Flexible, Rigid and Rigid-Flex PCBs


• Single and Double Layers, Multilayer
• all base materials available


• Electronic Assembly (wired and SMD components)
  according to customer specification

Moulded Interconnect Devices (3D MID)

Moulded Interconnect Devices (MID) are plastic components containing electric printed circuit boards and function therefore as 3D-PCBs. The patented LDS (Laser-Direct-Structuring) has proved indispensable for the manufacture of MID components. And for certain applications, for example in Automotive and Medicine, MID-components are a cost-saving alternative to conventional circuit-board constructions.

Obvious advantages are:

• MIDs consists of fewer electrical components
• Space-saving
• Manufacturing and Assembly processes shortened